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Facilities

Masimo Semiconductor Facilities

Masimo Semiconductor’s large, modern offices and laboratories in Hudson, New Hampshire provide MOCVD and fabrication lines in a state-of-the-art class 100/1000 facility.

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MOCVD Growth Facility

Masimo Semiconductor operates MOCVD (Metal Organic Chemical Vapor Deposition) epitaxial reactors in multiple shifts, providing ample capacity for development and production of 50mm, 75mm, 100mm, and 150mm GaAs and InP based custom epitaxial wafers. Our reactors are configured for a variety of material systems and process conditions.

Dopants

• C

• Zn

• Si

• Te

Masimo Semiconductor has extensive experience in the growth of most III-V epitaxial structures:

GaAs

GaAs

GaAlAs

GaInAs

GaInAlAs

InP

InP

InGaP

InGaAs

InGaAsP

InGaAlP

Foundry Service Facility

Masimo Semiconductor maintains a wafer-processing laboratory that is used for custom and production services. Capabilities include CAD design of photolithographic mask sets, development of custom device processes as well as routine fabrication processes. Capabilities range from prototype development to full production.

Equipment and processes include:

Advance III-V Materials

  • Semi and automatic wafer dicing for die separation

  • Wafer mounting to tape for dicing/cleaving machines

  • Strip/de-scum resist

  • Contact/proximity and vacuum photolithography

  • Coat bake system positive resist, polyimide, negative resist

  • Photoresist development station

  • Solvent clean stainless hood with fire suppression for wafer cleaning

  • Inspection microscopes for measurement of critical dimensions

  • Flood UV exposure

InP • GaAs • GaN • GaSb

  • Ammonia vapor system for reversing resist images

  • Hot plate/Oven bake resist

  • Cassette rinse/dry

  • Silicon nitride, silicon dioxide, silicon oxynitride PECVD

  • Reactive ion etch: vertical sidewall/trench etching of GaAs related compounds and dielectrics

  • Reactive index and dielectric film thickness measurement

  • Extensive selective etch library

  • Acid compatible hood for wafer etching

  • Base compatible hood for wafer etching

III-V Foundry Service

  • Stylus contact contour measurement system

  • Electrical probe station for contact resistance measurement

  • Rapid thermal annealing of metal films

  • Optical coating evaporation

  • Electron beam evaporation of P-Ohmic & N-Ohmic metals

  • Temporary carrier mounting for lapping and polishing

  • Heat uniform hot plate

  • Non-contact thickness measurement system for lap/polish

  • Pick & place: die removal from carrier into trays

  • Die and device inspection

Device Fabrication Facility

Masimo Semiconductor operates a complete compound semiconductor device fabrication line housed in a 13,500 square foot, class 100/1000 clean room.

Process equipment includes:

  • Contact photolithography (2µm critical dimension)
  • Wet etch and dry etch (reactive ion etching)
  • PECVD silicon nitride, silicon oxynitride, SiO2
  • Metallization
  • Dielectric deposition
  • Optical thin film deposition
  • RTP
  • Wafer polishing and lapping
  • Wafer dicing (automated sawing & cleaving)
  • Final test
FT-1745A-1222
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