Fabrication, Development & Production
Masimo Semiconductor operates a complete compound semiconductor device fabrication line focused on the fabrication of custom devices, as well as development, prototyping, pilot production and manufacturing. Capabilities of the custom and production wafer processing laboratory at Masimo Semiconductor range from prototype development to full production and include CAD design of photolithographic mask sets, development of custom device processes, and routine fabrication.
Foundry services
Photolithography
Wet etch & dry (Reactive Ion etching)
PECVD silicon nitride, silicon oxynitride, silicon dioxide
Metalization
Dielectric
Optical thin film deposition
Wafer polishing & lapping
Automated wafer probing
Wafer dicing (automated sawing)
Previous
Next
CUSTOM III-V DEVICES
Ridge waveguide devices
Red to IR VCSELs
Red to IR Lasers
Thermal photovoltaic devices
Avalanche photo diodes
Sensing
Optical modulation devices
Optical frequency conversion devices
Laser power converters
GaAs based P-I-N photodetectors
InP based P-I-N photodetectors
High efficiency solar cells
Fabrication Process Services
At Masimo Semiconductor, we take epitaxial wafers through the full wafer fabrication process flow. This includes GaAs, GaN, GaSb, InP and InAs wafers up to 4 inches in size. These wafers can be grown at Masimo Semiconductor’s facility or supplied by customers. Customers can also supply photomasks, or we can provide the engineering expertise to develop a process flow and CAD layout used to develop a new set of masks or cross-sectional concept drawings. We specify the process steps or collaborate and agree on parameter conditions to meet the desired device feature and implement the process in our fabrication line. This saves development time for our customers and provides a source of proprietary devices without the expense of a dedicated internal fabrication line.
